Preliminary Call for Participation
The 2009 High Performance Computing &
In Conjunction With
The International Wireless Communications
Computing Conference (IWCMC 2009)
June 21 - 24, 2009
Co-Sponsored by IEEE Germany, ASIM, EUROSIM, CASS, JSST, LSS, PTSK, TSS, University of Leipzig
(Extended Paper Submission Deadline: March 5, 2009)
Workshops and Special Sessions are
available in the top menu under Documents
Agenda and Program are also available under Documents
Tutorials, Keynote, and Plenary Notes are available now under Documents
HPCS 2009 Proceedings and Papers are posted on the IEEE Xplore Digital Library and available at http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=5173446
You are cordially invited to participate in and attend the 2009 High Performance Computing & Simulation Conference to be held in Leipzig, Germany, June 21 - 24, 2009 in conjunction with the International Wireless Communications and Mobile Computing Conference (IWCMC 2009). The conference is to address, explore and exchange information on the state-of-the-art in high performance and large scale computing systems, their use in modeling and simulation, their design and use, and their impact. Participation is extended to researchers, designers, educators and interested parties in all related disciplines and specialties.
The conference will include invited presentations from experts from academia, industry, and government as well as contributed paper presentations describing original work on the current state of research in HPC & Simulation technologies and systems and related issues.
Architectures and Systems
Software and Middleware in HPC Systems
Applications Oriented High Performance
Submission of Papers:
Papers reporting original and unpublished research results on above and related HPC topics are solicited. Please submit an electronic copy of your full manuscript (not to exceed 8 double-column IEEE formatted pages, including figures, tables, and references). Please clearly indicate the corresponding author. Include up to 6 keywords from the above list and an abstract of no more than 350 words. Papers must be submitted in .pdf format only via web at the following conference website: http://cisedu.us/cis/hpcs/09/main/callForPapers.jsp . More detailed submission procedures will be available on this website. If accepted, the final camera-ready manuscript will follow the format posted, which will be made available to all authors.
Consistent with standard practice, each submitted paper will receive a minimum of three reviews. Papers will be selected based on their originality, timeliness, significance, relevance, and clarity of presentation. Initial selection will be based on full papers. Submission implies the willingness of at least one of the authors to register and present the paper, if accepted. All accepted papers in the conference are required to be presented and will be included in the conference proceedings. Manuscripts submitted should not be under simultaneous consideration by any other conference or venues.
If you have any questions about paper submission or program, please contact conference Program Chair: Waleed W. Smari, Dept. of Electrical and Computer Engineering, University of Dayton, 300 College Park, Dayton, OH 45469-0226, USA, Voice: (937) 229-2795, Fax: (937) 229-4529, Email: Smari@arys.org.
For information about the HPCS conference in general, please contact the General Co-Chairs.
Important Dates (Extended):
|Full Paper Submission Deadline||March 5, 2009|
|Notification of Acceptance||March 30, 2009|
|Registration & Camera-Ready Manuscripts Due||April 24, 2009|
Workshops and Special Sessions
Workshops and special sessions on HPCS related topics are welcomed too. A workshop or a special session proposal should include a title, topics covered by the workshop, organizers information, submission instructions, review process, important dates, total number of expected accepted papers, and any other information for the authors. Proposals for workshops and special sessions should be submitted by January 31, 2009 as a Word file email attachment.
Panels and Forums
Panel sessions and forums will examine innovative, promising, or controversial HPCS issues today. They will also address HPCS challenges and future prospects. Audience participation will be welcomed. If you have ideas or questions concerning Conference's panels and forums, please contact Panels Chair. Proposals are welcomed and should be submitted by February 28, 2009.
Demos and experiential showcases of HPC environments and tools are highly encouraged. These may include any of the themes outlined in the conference topics. If you have any questions, please contact Demos Chair. Proposals for demos are welcomed and should be submitted by April 1, 2009. Demo form can be downloaded here.
Sponsorship and Industry Liaison
The HPCS 2009 Conference seeks interested Industry Partners who would be willing to sponsor conference events or social activities (e.g., exhibit reception, speaker sponsorship, registration handout packets, special break snacks, etc.). If an industry representative is interested in becoming an HPCS 2009 Industry Partner or would like to propose an event or activity at the conference, please contact the Industry Liaison Chair.
For further information or questions about the conference, please consult the web site at URL: http://cisedu.us/cis/hpcs/09/main/callForPapers.jsp.
For information about WICMC 2009, consult the IWCMC'09 web site at URL: http://iwcmc.com or contact IWCMC'09 organizers.
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